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regarding the change of names mentioned in the document, such as hitachi electric and hitachi xx, to renesas technology corp. the semiconductor operations of mitsubishi electric and hitachi were transferred to renesas technology corporation on april 1st 2003. these operations include microcomputer, logic, analog and discrete devices, and memory chips other than drams (flash memory, srams etc.) accordingly, although hitachi, hitachi, ltd., hitachi semiconductors, and other hitachi brand names are mentioned in the document, these names have in fact all been changed to renesas technology corp. thank you for your understanding. except for our corporate trademark, logo and corporate statement, no changes whatsoever have been made to the contents of the document, and these changes do not constitute any alteration to the contents of the document itself. renesas technology home page: http://www.renesas.com renesas technology corp. customer support dept. april 1, 2003 to all our customers
cautions keep safety first in your circuit designs! 1. renesas technology corporation puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. trouble with semiconductors may lead to personal injury, fire or property damage. remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. notes regarding these materials 1. these materials are intended as a reference to assist our customers in the selection of the renesas technology corporation product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to renesas technology corporation or a third party. 2. renesas technology corporation assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. 3. all information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by renesas technology corporation without notice due to product improvements or other reasons. it is therefore recommended that customers contact renesas technology corporation or an authorized renesas technology corporation product distributor for the latest product information before purchasing a product listed herein. the information described here may contain technical inaccuracies or typographical errors. renesas technology corporation assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. please also pay attention to information published by renesas technology corporation by various means, including the renesas technology corporation semiconductor home page (http://www.renesas.com). 4. when using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. renesas technology corporation assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. 5. renesas technology corporation semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. please contact renesas technology corporation or an authorized renesas technology corporation product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use. 6. the prior written approval of renesas technology corporation is necessary to reprint or reproduce in whole or in part these materials. 7. if these products or technologies are subject to the japanese export control restrictions, they must be exported under a license from the japanese government and cannot be imported into a country other than the approved destination. any diversion or reexport contrary to the export control laws and regulations of japan and/or the country of destination is prohibited. 8. please contact renesas technology corporation for further details on these materials or the products contained therein.
2SC5700 silicon npn epitaxial vhf/uhf wide band amplifier ade-208-1435 (z) rev.0 jul. 2001 features ? high power gain low noise figure at low power operation: |s 21 | 2 = 16 db typ, nf = 1.0 db typ (v ce = 1 v, i c = 5 ma, f = 900 mhz) outline mfpak 1. emitter 2. base 3. collector 1 3 2 note: marking is ?wb??.
2SC5700 rev.0, jun. 2001, page 2 of 10 absolute maximum ratings (ta = 25 c) parameter symbol value unit collector to base voltage v cbo 15 v collector to emitter voltage v ceo 4 v emitter to base voltage v ebo 1.5 v collector current i c 50 ma collector power dissipation pc 80 mw junction temperature tj 150 c storage temperature tstg ? 55 to +150 c electrical characteristics (ta = 25 c) item symbol min typ max unit test conditions collector to base breakdown voltage v (br)cbo 15 ? ? v i c = 10 a, i e = 0 collector cutoff current i cbo ? ? 0.1 a v cb = 15 v, i e = 0 collector cutoff current i ceo ? ? 1 a v ce = 4 v, r be = infinite emitter cutoff current i ebo ? ? 200 na v eb = 0.8 v, i c = 0 dc current transfer ratio h fe 100 130 170 ? v ce = 1 v, i c = 5 ma collector output capacitance c ob ? 0.4 0.7 pf v cb = 1 v, i e = 0, f = 1 mhz gain bandwidth product f t 10 12 ? ghz v ce = 1v, i c = 5 ma forward transmission coefficient |s 21 | 2 13 16 ? db v ce = 1 v, i c = 5 ma, f = 900 mhz noise figure nf ? 1.0 1.7 db v ce = 1 v, i c = 5 ma, f = 900 mhz, s = l = 50 ohm
2SC5700 rev.0, jun. 2001, page 3 of 10 0 50 100 150 200 100 collector power dissipation pc (mw) collector power dissipation curve 10 100 200 0 120 collector current i c (ma) dc current transfer ratio h fe dc current transfer ratio vs. collector current 25 50 v ce = 1 v 0 0.4 0.6 1 collector current i c (ma) typical transfer characteristics 0 12 34 collector current i c (ma) typical output characteristics ambient temperature ta ( c) collector to emitter voltage v ce (v) base to emitter voltage v be (v) 0.2 0.8 v ce = 1 v 20 40 60 80 100 10 20 30 40 50 500 a i b = 50 a 100 a 150 a 200 a 250 a 300 a 350 a 400 a 450 a 10 20 30 40 50
2SC5700 rev.0, jun. 2001, page 4 of 10 1 10 100 1 2 5 10 20 50 100 0 4 8 12 16 20 collector current i c (ma) s 21 parameter | s 21 | 2 (db) s 21 parameter vs. collector current collector current i c (ma) 4 8 12 16 20 0 2 5 20 50 v ce = 1v f = 2 ghz v ce = 1 v f = 900 mhz 1.2 2.0 collector to base voltage v cb (v) collector output capacitance c ob (pf) collector output capacitance vs. collector to base voltage 0.2 0.4 0.6 0.8 1.0 0 0.4 0.8 1.6 1 2 5 10 20 50 100 0 4 8 12 16 20 collector current i c (ma) gain bandwidth product f t (ghz) gain bandwidth product vs. collector current v ce = 1 v f = 2 ghz i e = 0 f = 1 mhz s 21 parameter vs. collector current s 21 parameter | s 21 | 2 (db)
2SC5700 rev.0, jun. 2001, page 5 of 10 10 3 5 0 1 20 100 collector current i c (ma) noise figure nf (db) noise figure vs. collector current 25 50 4 2 1 v ce = 1 v f = 900 mhz
2SC5700 rev.0, jun. 2001, page 6 of 10 10 5 4 3 2 1.5 1 .8 -2 -3 -4 -5 -10 .6 .4 .2 0 -.2 -.4 -.6 -.8 -1 -1.5 .2 .4 .6 .8 1 2 3 4 5 1.5 10 0 30 60 90 120 150 180 -150 -90 -60 -30 -120 30 60 90 120 150 180 -150 -90 -60 -30 -120 10 5 4 3 2 1.5 1 .8 -2 -3 -4 -5 -10 .6 .4 .2 0 -.2 -.4 -.6 -.8 -1 -1.5 .2 .4 .6 .8 1 2 3 4 5 1.5 10 scale: 8 / div. scale: 0.06 / div. 0 s 11 parameter vs. frequency s 21 parameter vs. frequency s 12 parameter vs. frequency s 22 parameter vs. frequency condition: v ce = 1 v , z o = 50 ? 100 to 2000 mhz (100 mhz step) ( i c = 5 ma) ( i c = 20 ma) condition: v ce = 1 v , z o = 50 ? 100 to 2000 mhz (100 mhz step) ( ic = 5 ma) ( ic = 20 ma) condition: v ce = 1 v , z o = 50 ? 100 to 2000 mhz (100 mhz step) ( i c = 5 ma) ( i c = 20 ma) condition: v ce = 1 v , z o = 50 ? 100 to 2000 mhz (100 mhz step) ( i c = 5 ma) ( i c = 20 ma)
2SC5700 rev.0, jun. 2001, page 7 of 10 s parameter (v ce = 1 v, i c = 5 ma, z o = 50 ? ? ? ? ) s11 s21 s12 s22 f (mhz) mag ang mag ang mag ang mag ang 100 0.855 ? 16.3 15.67 165.4 0.018 81.2 0.962 ? 10.7 200 0.784 ? 32.7 14.42 152.1 0.035 72.2 0.889 ? 20.9 300 0.703 ? 48.4 12.92 140.6 0.048 65.3 0.791 ? 28.9 400 0.616 ? 60.4 11.41 131.2 0.059 61.2 0.698 ? 34.6 500 0.540 ? 72.1 10.09 123.5 0.067 58.6 0.618 ? 38.2 600 0.475 ? 81.4 8.94 117.2 0.074 57.3 0.549 ? 40.7 700 0.428 ? 90.3 8.00 112.3 0.080 56.6 0.492 ? 42.1 800 0.385 ? 99.1 7.23 108.2 0.085 56.1 0.445 ? 42.5 900 0.348 ? 106.5 6.54 104.2 0.091 56.3 0.404 ? 42.7 1000 0.320 ? 113.6 6.00 100.9 0.096 57.3 0.373 ? 42.0 1100 0.297 ? 121.6 5.51 98.2 0.101 57.4 0.344 ? 41.6 1200 0.283 ? 128.8 5.14 95.4 0.106 57.8 0.321 ? 40.7 1300 0.271 ? 134.6 4.80 93.1 0.111 58.7 0.298 ? 39.1 1400 0.262 ? 142.4 4.47 90.8 0.117 59.2 0.283 ? 37.5 1500 0.254 ? 149.0 4.23 89.0 0.122 60.0 0.263 ? 36.3 1600 0.246 ? 155.3 3.99 87.0 0.128 60.5 0.252 ? 34.6 1700 0.248 ? 160.8 3.79 85.3 0.134 61.1 0.238 ? 33.0 1800 0.249 ? 167.3 3.59 83.7 0.140 61.5 0.226 ? 31.3 1900 0.253 ? 172.0 3.44 81.9 0.145 62.1 0.215 ? 29.6 2000 0.253 ? 177.5 3.29 80.5 0.151 62.7 0.204 ? 27.2
2SC5700 rev.0, jun. 2001, page 8 of 10 (v ce = 1 v, i c = 20 ma, z o = 50 ? ? ? ? ) s11 s21 s12 s22 f (mhz) mag ang mag ang mag ang mag ang 100 0.526 ? 43.0 37.91 148.3 0.015 75.0 0.817 ? 25.2 200 0.406 ? 76.6 27.98 127.5 0.025 67.3 0.605 ? 40.0 300 0.334 ? 100.0 20.76 115.3 0.033 66.9 0.453 ? 45.9 400 0.284 ? 116.6 16.30 108.1 0.040 68.0 0.360 ? 47.1 500 0.263 ? 131.4 13.33 103.0 0.047 69.8 0.300 ? 46.2 600 0.243 ? 143.4 11.24 99.2 0.055 71.1 0.257 ? 44.4 700 0.242 ? 152.6 9.74 96.3 0.063 72.0 0.226 ? 41.4 800 0.236 ? 159.6 8.57 93.6 0.071 72.7 0.203 ? 38.2 900 0.230 ? 167.8 7.62 91.4 0.078 73.5 0.184 ? 34.3 1000 0.239 ? 173.4 6.91 89.4 0.086 74.1 0.170 ? 30.5 1100 0.240 ? 179.4 6.31 87.7 0.094 73.9 0.160 ? 26.8 1200 0.247 175.6 5.82 85.9 0.102 74.1 0.150 ? 22.6 1300 0.246 172.4 5.38 84.4 0.110 74.4 0.143 ? 18.1 1400 0.255 167.4 5.02 82.9 0.117 74.3 0.138 ? 14.0 1500 0.257 163.8 4.71 81.3 0.126 74.2 0.133 ? 9.6 1600 0.265 160.2 4.45 80.1 0.134 74.4 0.130 ? 5.3 1700 0.268 158.7 4.19 78.9 0.142 74.2 0.128 ? 1.2 1800 0.282 154.1 3.97 77.6 0.149 73.9 0.125 2.5 1900 0.283 152.7 3.80 76.4 0.157 74.1 0.123 7.1 2000 0.300 150.3 3.63 75.4 0.165 73.7 0.123 11.8
2SC5700 rev.0, jun. 2001, page 9 of 10 package dimensions 0.9 0.1 1.4 0.05 1.2 0.05 0.8 0.1 3-0.2 +0.1 ? 0.05 0.2 0.2 0.45 0.45 (0.1) (0.1) 0.6 max hitachi code jedec eiaj mass (reference value) mfpak ? ? 0.0016 g 0.15 +0.1 ? 0.05 as of january, 2001 unit: mm
2SC5700 rev.0, jun. 2001, page 10 of 10 disclaimer 1. hitachi neither warrants nor grants licenses of any rights of hitachi?s or any third party?s patent, copyright, trademark, or other intellectual property rights for information contained in this document. hitachi bears no responsibility for problems that may arise with third party?s rights, including intellectual property rights, in connection with use of the information contained in this document. 2. products and product specifications may be subject to change without notice. confirm that you have received the latest product standards or specifications before final design, purchase or use. 3. hitachi makes every attempt to ensure that its products are of high quality and reliability. however, contact hitachi?s sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment or medical equipment for life support. 4. design your application so that the product is used within the ranges guaranteed by hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics. hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as fail- safes, so that the equipment incorporating hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the hitachi product. 5. this product is not designed to be radiation resistant. 6. no one is permitted to reproduce or duplicate, in any form, the whole or part of this document without written approval from hitachi. 7. contact hitachi?s sales office for any questions regarding this document or hitachi semiconductor products. sales offices hitachi, ltd. semiconductor & integrated circuits nippon bldg., 2-6-2, ohte-machi, chiyoda-ku, tokyo 100-0004, japan tel: (03) 3270-2111 fax: (03) 3270-5109 copyright ? hitachi, ltd., 2001. all rights reserved. printed in japan. hitachi asia ltd. hitachi tower 16 collyer quay #20-00 singapore 049318 tel : <65>-538-6533/538-8577 fax : <65>-538-6933/538-3877 url : http://www.hitachi.com.sg url northamerica : http://semiconductor.hitachi.com/ europe : http://www.hitachi-eu.com/hel/ecg asia : http://sicapac.hitachi-asia.com japan : http://www.hitachi.co.jp/sicd/indx.htm hitachi asia ltd. (taipei branch office) 4/f, no. 167, tun hwa north road hung-kuo building taipei (105), taiwan tel : <886>-(2)-2718-3666 fax : <886>-(2)-2718-8180 telex : 23222 has-tp url : http://www.hitachi.com.tw hitachi asia (hong kong) ltd. group iii (electronic components) 7/f., north tower world finance centre, harbour city, canton road tsim sha tsui, kowloon hong kong tel : <852>-(2)-735-9218 fax : <852>-(2)-730-0281 url : http://semiconductor.hitachi.com.hk hitachi europe gmbh electronic components group dornacher stra?e 3 d-85622 feldkirchen, munich germany tel: <49> (89) 9 9180-0 fax: <49> (89) 9 29 30 00 hitachi europe ltd. electronic components group whitebrook park lower cookham road maidenhead berkshire sl6 8ya, united kingdom tel: <44> (1628) 585000 fax: <44> (1628) 585200 hitachi semiconductor (america) inc. 179 east tasman drive san jose,ca 95134 tel: <1> (408) 433-1990 fax: <1>(408) 433-0223 for further information write to: colophon 4.0

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